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The high pass snapdragon 875 has won the title of Android processor, but the external 5g baseband has become its disadvantage

2020-11-10 08:59:47 osc_kgvf7iif

As chip companies have released new chips , Mobile phone chip No.1, new high-end chip from Qualcomm 875 Also began to appear in performance testing software , In terms of performance, this chip will undoubtedly become the king of Android Market , Unfortunately, the chip is not integrated 5G baseband .

It's said that the snapdragon 875 Will adopt 1+3+4 framework , It's a X1+ three A78+ Four pieces A55,X1 The core is ARM The latest high performance core released , The performance has been greatly improved , supplemented 5nm process , So it can provide powerful performance , According to the test of rabbit and rabbit, the running points of this chip can reach 85 Thousand times , Crush all the current Android phone chips .

What's new with Qualcomm 5G The baseband is called X60, Same use 5nm Process production , Compared with other Android phone chips ,X60 The biggest feature is to support 5G Millimeter wave technology , This is what the United States has always stressed 5G technology , China and Europe advocate 5G Centimeter wave technology , High pass X60 Baseband in order to meet the needs of all over the world at the same time support 5G Millimeter wave sum 5G Centimeter wave technology , Maybe the technology is too complex and the power consumption is too high to match the snapdragon 875 Chip integration into SOC chip .

The chip doesn't integrate baseband , It will lead to the power consumption of mobile phone chips 、 The cost is too high , The snapdragon released by Qualcomm last year 865 The chip is not integrated 5G baseband X55, This led to the adoption of snapdragon 865 Chip 5G Mobile phones are expensive , Among them, Xiaomi claims to adopt Xiaolong 865 Chip millet 10 It's just the chips paid for by Qualcomm 、 Patent fees and other costs are as high as 1500 element , It accounts for nearly 40% of the price of the mobile phone .

Currently released 5G High power consumption is a common problem in mobile phones , Apple released iPhone12 It was exposed to open 5G After the surge in power consumption, resulting in a significant reduction in battery life , Other Android phones can only increase the battery capacity in order to ensure the battery life .

The result is that 5G Due to the use of high frequency band 5G Baseband has a small coverage , There is a large amount of data transmission , Qualcomm 5G Chip snapdragon 875 The use of external baseband will undoubtedly lead to further impact on the battery life of the mobile phone , This is also the current Android phone weight more than 200g Why , So Android 5G Mobile phones are also derided as half Jin machines .

For well-known reasons , TSMC cannot manufacture chips for Huawei , Chinese mobile phone companies can choose 5G The only high-end chip left is MediaTek , I wonder if the high-end chip that MediaTek will release can match with the snapdragon of Qualcomm 875 competition . If the United Nations Development Agency 5G High end chips have their own advantages , It will further consolidate its leading position in China's mobile phone chip market , Since the beginning of this year, MediaTek has gained a leading position over Qualcomm in China's mobile chip market .

In the face of the opportunities offered by the weakening of the Chinese market by Qualcomm , South Korea's Samsung also took the opportunity to strengthen its attack on China's mobile phone chip market , Recently, there are rumors that Xiaomi 、OPPO They are interested in cooperating with Samsung , And the one that has worked with Samsung before vivo Cooperation will be further strengthened .

Qualcomm in 5G There is no integration on the chip 5G baseband , It shows that its technical strength has been weakened , It's hard to continue to be the world's number one mobile chip player , MediaTek and Samsung are stepping up their attack on Qualcomm , It will further increase the pressure on Qualcomm in the mobile chip market .

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Boming Technology BMtech007

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